TECHNET Archives

October 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: White substance
From:
Hinners Hans Civ WRALC/LYPME <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 Oct 1999 14:23:47 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (39 lines) 
        Hello jhwm,

        Do you mean the wall of a plated through hole wall or the wall of a
particular plating tank?

        Copper plating - electroless or electrolytic?

        Who's chemistry?

        Hans

~~~~~~~~
Hans M. Hinners                                 WR-ALC/LYPME Bldg. 640
Materials Engineer                                      380 Second Street,
Suite 104
Manufacturing Eng. Sec.                         Robins AFB GA 31098-1638
912-926-1970 (Voice) 468 - 1970 (DSN)   912-926-7974 (Fax)
mailto:[log in to unmask]


> Technetters,
> My question is: What is the white substance adhering to the wall of the
> plating copper solution bath.
> Many thanks in advance...

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2