In a message dated 10/06/1999 3:32:58 PM Central Daylight Time,
[log in to unmask] writes:

<< Steve,

 You know I love you but, how did you get into this in the first place?

 Surface copper gets plated "up" to a specified thickness based on hole
 plating thickness requirements. If the hole is specified at 1 mil minimum,
 usually the surface thickness plating is about 1.2 mils or so thick. The
 inners are as specified except for thickness degradation from
 cleaning/etching, etc.

 Earl >>

Aww crap Earl, who knows? Now I gotta backtrack and try to find out what
happened.
Get a microsection done, prove there's a problem, and then re-build
everything we've built already, in the mean time we're gonna take it in the
shorts money-wise because are finding out after the fact that there's a
problem with this fab...and of course the fab vendor will probably say; "Hey,
we'll give you new boards..." but what about all our material and labor costs
we've already put into this assembly.

Only way to prevent this I guess is to not trust anybody, and do our own
microsections before we accept the fabs in the first place. It'll keep people
honest...

-Steve Gregory-

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