TECHNET Archives

April 2014

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Robert e. welch" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 3 Apr 2014 12:43:57 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines)
Try John Robinson at
http://www.ecems.net/
He is The Cuposit Guru.

Robert E. Welch
Senior Process Engineer
Moog Components Group


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jana Carraway
Sent: Wednesday, April 02, 2014 7:18 PM
To: [log in to unmask]
Subject: [TN] Dow Chemical Technical Contact

Could someone share contact information for a technical resource at Dow?  I have questions regarding electroless ( they are now the owners of the Shipley Cuposit formulas) and EVF plating.

Help is greatly appreciated,
Jana Carraway

Sent from my iPhone


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2