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September 2009

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 17 Sep 2009 13:22:18 -0400
Content-Type:
text/plain
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text/plain (114 lines)
 Hi Ioan,
First, remember that any industry document represents the lowest common denominator of the committee participants.
Second, most IPC documents address 'quality' and not 'reliability'—which clearly are not the same thing.
Third, many of these documents address issues from a contractual legalistic perspective which is not necessarily the same as the technical perspective. 
Werner


 


 

-----Original Message-----
From: Ioan Tempea <[log in to unmask]>
To: [log in to unmask]
Sent: Thu, Sep 17, 2009 10:44 am
Subject: [TN] IPC-610 vs lab results










Dear Technos,

 

I have to get out of this situation regarding the quality of certain boards:

·         On one hand certain pads have the visual aspect of dewetting, being, 
once again, visually just like in Figure 5-41 para 5.2.5 of IPC-610

·         On the other hand I have 2 lab reports, reputed labs, saying the 
joints are reliable (good wetting angles and IMC)

 

The visual confusion comes from the excessive length of the pads, the solder 
kinda fades away before reaching the tip of the pads, but everything looks very 
well in the component pin area.

 

The question is: is there any IPC document stating something like "IPC-610 is a 
visual guide only, lab results overrule it"? Otherwise said, the joint quality 
is there, proved by x-sectioning, so why bother with the visual aspect.

 

Thanks,

 

Ioan Tempea, ing.

Ingénieur Principal Fabrication / Sr. Manufacturi
ng Engineer 

 

 

30 ans déjà! - 30 years already!

950 rue Bergar, Laval, Québec, H7L 5A1

t : 450-967-7100 ext : 244

Mtl : 514-990-5762

f : 450-967-7444

[log in to unmask] <mailto:[log in to unmask]> 

www.digico.cc <http://www.digico.cc/> 

P N'imprimer que si nécessaire - Print only if you must

 


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