TECHNET Archives

October 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Two distinct layers of copper...
From:
"Scott A. Bowles" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 7 Oct 1999 15:06:46 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
Steve,
Can you get a microsection of the area in question where the pad seems to
have split, horizontally, in half?  It could possibly be separation of the
electroless copper to the foil or electroplated copper from the electroless.
Scott A. Bowles
Sovereign Circuits

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2