Standby for a welter of responses!
Here is a simple answer.
The Au issue for Sn96 is the same for Sn63. Except that as there is about 50% more
tin present per joint the amount of gold per unit of tin is less, so Au embrittlement
is less likely. So basically if you reckno you could do it in Sn63 you will be OK in
Sn96. For further details refer to almost anything written on lead free I guess.

Mike Fenner
BSP, OX15 4JQ, England
T: +44 1295 722 992
M: +44 789 999 7715
F: +44 1295 720 937

For product information visit www.belzona.com
-----Original Message-----
From: Stephen R. Gregory <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: 24 August 1999 17:52
Subject: [TN] SN96 solder...


>Hi ya'll!
>
>I've got a project coming where it's called out to use a SN96 solder. Not
>having the characteristics on the top of my head, I went to a web page to
>refresh my memory. A SN 96 alloy is 96.5% Tin, and 3.5% Silver. It's a
>eutectic alloy with the liquidous and solidus temperature at 221-degrees C.
>
>The page stated the typical use was in applications where standard lead based
>solders did not meet the safety or strength requirements. It also went on to
>say that a SN96 was not recommended against gold plated surfaces. Guess what?
>I was told the PCB is gold plated!
>
>So what is the issue, gold embrittlement? Undesirable intermetallics? Would
>sure like to know something about this...
>
>Appreciate any info!
>
>-Steve Gregory-
>
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