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July 1998

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From:
superflx <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Jul 1998 08:37:01 -0400
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Todd,

In our experience, the reason most people run between 235-250C is twofold: it produces less dross
and it gives the flux (especially No-Cleans) the best environment in which to be effective.  In
many cases where a higher temperature is used, it was done to compensate for high levels of
oxidation or was implemented from a different process.  Not knowing board thickness, component
quality, or density, it is likely that going to a lower temperature may produce a shinier fillet,
good wicking, and less dross in the pot.

Phil

Running at 261C will

Todd Ness wrote:

> Hi,
>
> I would like to know the differences between having our solder pot
> temp for 63/37 solder at 261 Degrees C instead of 250 Degrees C. Will
> we see less bridging and better top-side flow at the higher temp? Are
> there any pros and cons for the different temperatures?
>
> Thanks,
> Todd N
>
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