I will send you a matrix showing the differences.
Likely your via's will not have adequate pad to hole to meet class 3.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jay Otts
Sent: Saturday, January 06, 2007 3:24 PM
To: [log in to unmask]
Subject: [TN] Reliability 6012 Cl2 vs. Cl3
Need help in quantifying difference in reliability prediction for a
specific board
design meeting 6012 Class 2 vs. Class 3 requirements, given all
parameters
equal except internal annular rings. My concern is breakout allowed by
class 2
vs. 1 mil min. internal annular ring per class 3.
Parameters:
high quality FR4 material
15" x 15" size
20 layer high density
layers 1 -5 contain blind vias
finished board thickness appx. 0.110"
1mm dot pitch bga's
benign operating environment
Jay Otts
Raytheon
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