New designs and applications are constantly being developed for flexible
circuitry and chip scale packaging (CSP) technologies, and it's
essential to stay on top of these changes. IPC has assembled a lineup of
industry experts to speak at the International Conference on Flexible
Circuits and Chip Scale Packaging on July 24-25, 2006, in Minneapolis,
Minn.
This two day event, including workshops and a technical conference
covering the basics of flexible circuitry, IC packaging, defect free
fabrication and design, is where you need to be.
Visit www.ipc.org/flexnchips for a full conference agenda and set of
course descriptions. The one-day conference will take place on July 25.
Educational Courses - July 24, 2006:
The Complete Guide to Flexible Circuitry: Materials, Processes &
Packaging - 8:30am-4:30pm - Instructed by Ken Gilleo, Ph.D., ET-Trends
LLC
Advanced Packaging Technologies and Future Trends - 8:30am-11:30am -
Instructed by Joe Fjelstad, Silicon Pipe, Inc.
Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect
Analysis and Prevention 8:30am-11:30am - Instructed by Michael Carano,
Electrochemicals, Inc.
Flexible Circuit Design Principles and Fabrication Requirements -
1:00pm-4:00pm - Vern Solberg, Micro Electronic Engineering Services
Key Aspects of Desmear, Metallization and Electroplating of Flexible
Circuits - 1:00pm-4:00pm - Instructed by Michael Carano,
Electrochemicals, Inc.
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