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October 2007

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Subject:
Re: RoHS solder and wetting plus thermal reliefs
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 10 Oct 2007 16:44:16 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines) 
Hi Phil,
You did not say how thick your PWBs are, but I surmise they are thick.
Removing the thermal reliefs is likely to cause you soldering problems—they 
are there for a reason. 
For SAC soldering, you need more Cu for the via barrel walls because of the 
higher Cu dissolution rate of Cu in SAC. "100% barrel fill is desired with a 
good fillet top and bottom" implies filling with solder; besides poorer wetting, 
you really need to have the T's high enough—that is likely to cause some 
problems with your PWB resin system.

Werner



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