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Date: | Fri, 26 May 2006 08:51:39 -0700 |
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I wouldn't lead my customers to believe this is feasible.
Thank you,
Eddie Rocha
Hi Steve: Well; it depends...........
First: I'm going to assume you are using inches as the
units for
thickness.
Second: You are not concerned about the uniformity of
plating in the
holes vs. surface.
With that said the +/-0.0002 can be done but there are many
factors that
will influence it:
* Design
* Panel size
* Outer-layer circuit layout
* Uniformity of layout across the panel
* Plating robbers
* Plating thickness
* Process
* Rectification
* Current density
* Plating time
* Anode distribution
* Anode/cathode ratio
* Anode maintenance
* Plating rack material/design/attachment
* Plating bath agitation
* Plating tank size/design
* Plating bath chemistry
* Plating bath maintenance
There are other factors but you get the idea. The
goal is to
create a uniform current distribution across the panel.
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett WA
425-446-6076
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve
Kelly
Sent: Thursday, May 25, 2006 7:17 AM
To: [log in to unmask]
Subject: [TN] Copper plating question
Good Day To All,
I have a copper plating distribution question. Is it
possible to hold
the
pattern copper plating thickness to +/-.0002 across a
panel. Anyone want
to
venture what kind of Cp and Cpk they might hold? Thanks in
advance.
Steve
Kelly
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