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October 1999

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Subject:
TIN/GOLD alloy
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 17 Oct 1999 22:00:25 +0200
Content-Type:
text/plain
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text/plain (29 lines) 
Dear TechNetters!
Please could you comment on the use of Tin/Gold 90/10 solder ?
The application is for microwave applications when soldering to gold.
Its melting temp. is 217C .
I have the following questions:
How does this composition correlate with the maximum gold content in a
solder joint?
Would it be possible to pass such a subassembly through a secondary
reflow with 63/37 Tin/Lead?
Is it recommended ONLY for soldering to gold?
It must be very expensive too??!!
Paul, Werner, my apologies.
Thank you
Gaby

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