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October 1999

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Subject:
From:
"Severson, Scott M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Oct 1999 16:11:03 -0500
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Don,

In my opinion pull strength is a very poor measure of reliability.  I don't
know off hand what the "pull strength" should be, however if the failure
occurs anywhere except at the interface between solder and lead (fracture
through bulk solder, wire tensile break, or pad pull off) the solder joint
is as good as it can be.

A micro-section of the joint is a better indication of the joint quality.
Hope this helps.

Scott M. Severson
Benchmark Electronics Inc. - Winona

-----Original Message-----
From: Steffen, Don E [mailto:[log in to unmask]]
Sent: Wednesday, October 13, 1999 2:58 PM
To: [log in to unmask]
Subject: [TN] Pull Strength Value


Techno's

I have an anomaly that I wonder if anyone out there can help me with. My
customer is asking me to come up with a Pull Strength value. The discription
of the anomaly is that I have a 42 gauge, Copper ciol wire that is hand
soldered to a gold plated terminal. I need to quantify the strength of the
solder bond of the 42 gauge wire that is soldered to the gold lead. I want
to due a pull test of the wire with a Chillion Pull gage. Does anyone out
there know what the value that is considered to pull a wire away from
solder? How is this test performed?

Senior Quality Engineer
VDO Control Systems
Auburn, IN 46706
Phone (219)925-8887
Fax (219)925-8710
Email: [log in to unmask]

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