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| Date: | Fri, 13 Feb 2009 13:26:36 -0500 |
| Content-Type: | text/plain |
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Hi Inge,
We both know we would rather have no SAC.
Werner
-----Original Message-----
From: Inge <[log in to unmask]>
To: TechNet E-Mail Forum <[log in to unmask]>; Werner engelmaier <[log in to unmask]>
Sent: Fri, 13 Feb 2009 1:19 pm
Subject: Re: [TN] [tinwhiskers] - RoHS & BGAs!!!
a whole sac??
Inge?
?
----- Original Message -----
From: "Werner engelmaier" <[log in to unmask]>?
To: <[log in to unmask]>?
Sent: Friday, February 13, 2009 5:52 PM?
Subject: Re: [TN] [tinwhiskers] - RoHS & BGAs!!!?
?
> Hi Hani,?
> If you needed underfill with SnPb solders, you will even more need it with
> SAC.?
> For testing, use IPC-9701.?
>?
> Werner?
>?
>?
>?
>?
>?
>?
>?
> -----Original Message-----?
> From: AL-Yousef, Hani E <[log in to unmask]>?
> To: [log in to unmask]; TechNet E-Mail Forum <[log in to unmask]>;
> [log in to unmask]; SMART Group smart-e-link
> <[log in to unmask]>?
> Sent: Fri, 13 Feb 2009 11:27 am?
> Subject: [tinwhiskers] - RoHS & BGAs!!!?
>?
>?
>?
>?
>?
>?
>?
>?
>?
>?
>?
> Hello All,?
>?
> I am in the hunt for information on how to best evaluate whether?
> underfill is needed for SAC BGA when soldered with SAC paste.?
>?
> Also, part of my evolution is to find the right solder, flux and?
> chemistry to clean afterwards. Further specify a cleanliness level.?
>?
> I guess one has to find to the right test to use to evaluate these?
> parameters.?
>?
> Our products are expected to last for 20+ years while mounted outside on?
> a power distribution pole mounts.?
>?
>?
> I can use all the help I can get.?
>?
> Thanks?
> Hani?
>?
>?
>?
>?
>?
>?
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