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November 2010

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Subject:
From:
Bob Landman <[log in to unmask]>
Reply To:
Bob Landman <[log in to unmask]>
Date:
Mon, 29 Nov 2010 17:05:30 -0500
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Ioan,

3M recommends for residual ACF removal in their document "3MT Anisotropic Conductive Film (ACF) Adhesive 5363 Rework Process" technical bulletin many details, 3MT NovecT 72DA Engineered Fluid or Dioxolane (Stabilized with BHT): 

http://multimedia.3m.com/mws/mediawebserver?mwsId=66666UuZjcFSLXTtNXTto8TtEVuQEcuZgVs6EVs6E666666--

See http://www.novolyte.com/documents/brochures/1-3-dioxolane.pdf 


Hopefully the Hitachi product has similar chemical properties?

Bob 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Landman
Sent: Monday, November 29, 2010 4:51 PM
To: [log in to unmask]
Subject: Re: [TN] Cleaning of ACF bonder

Ioan,

Have you seen this paper on the use of ACF for displays?

http://www.tju-hj.com/publication/Bonding%20Parameters%20of%20Anisotropic%20Conductive%20Adhesive%20Film%20and%20Peeling%20Strength.pdf

Bob Landman
H&L Instruments,LLC
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Monday, November 29, 2010 1:32 PM
To: [log in to unmask]
Subject: [TN] Cleaning of ACF bonder

Dear Technos,

 

We need to clean the ACF bonder from a fair quantity of boards (about 1K/ month). The material to clean is Hitachi Anisolm, per the specification below (unfortunately there's not much in this spec)

http://lituo.testmart.cn/Images/UpLoadForderElse/2009_12_30_13_38_38_4939.pdf <http://lituo.testmart.cn/Images/UpLoadForderElse/2009_12_30_13_38_38_4939.pdf> 

 

We have been suggested to use a 48 hour soak in 1-Methyl-2-Pyrrolidinone, followed by an acetone cleaning. It is only the bonding contacts that are immersed in the methyl-pyrr..., but the level of substance is only 2 mm away from an overmolded die-attach. The acetone cleaning is local on the contacts.

 

First question would be: are the above chemicals OK for this usage? Board is FR4, with gold-plated contacts.

 

Second question would be: what else could we use to remove the bonder? Manufacturer seems to recommend Dow Corning OS-20, but we were told by our customers it does not exactly work.

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer T | 450.967.7100 ext.244 E | [log in to unmask] <mailto:[log in to unmask]> W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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