We are working on a new design that might be a candidate for HDI. I
have never had the opportunity to do such a design, but have read plenty of
articles regarding this approach. The main concern is that the engineers
want to place a  8-10 mil VIA's in the pads. I have explained to them that
this will cause soldering problems not mention contamination problems. What
is the cost benefit over laser drilled micro VIA's vs. conductive epoxy
filled vias in pads. Can a VIA survive the reflow and still be defect free?
Are there other concerns that I should be addressing besides the above
mentioned. Your input is greatly appreciated.

Regards,

Ted Tontis C.I.D.
Engage Networks
316 N. Milwaukee Street
Suite 214
Milwaukee WI, 53202
PH 414-273-7600 ext. 7607
FX 414-273-7601

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