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Date: | Fri, 27 Feb 2009 12:48:40 -0500 |
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You mean pb 90 sn 10?
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----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Fri Feb 27 11:03:39 2009
Subject: [TN] Reflowing CBGA component (with high Sn balls) using Eutectic solder paste
Hi All,
My question is related to the soldering of IBM PPC CBGAs type components
(that have Sn90Pb10 solder balls) using Sn63 paste onto ENIG finished
boards. What are the "determining-factors" to improve the
wetting/diffusion of the eutectic solder paste into the high Sn solder
balls. The eutectic solder appears to wet well to the ENIG pads located
on the board but occasionally I see eutectic solder fillets that do not
always appear to fuse well with the high Sn content balls (if fuse is
the correct word?). thx
Best Regards,
-Joe
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