I would suggest that 85/85 be used rather carefully.

If you're testing low solids fluxes you may get a false "warm fuzzy."

Many activators used in low solids no-clean evaporate at 85 C. From the SIR
it looks like you're doing good. But in the real world, i.e. non-85
operating conditions, your product may have problems. (See John Sohn's work
published I believe at an IPC conference.)

Also I would not recommend testing boards with plated through holes at
85/85. Lando et al (many years ago) showed that CAF is the dominant failure
mechanism under these conditions especially if there is any bias.

I am not a big fan of 85/85 although I had to do a lot of it over the years.


I'd be interested in others opinions on the subject.

Greg Munie



-----Original Message-----
From: Tim Reeves [mailto:[log in to unmask]]
Sent: Friday, September 13, 2002 8:03 AM
To: [log in to unmask]
Subject: Re: [TN] Reliability Testing 85/85


Victor,

The IPC Test Method 2.6.3e for Moisture and Insulation Resistance is also
known as a THB test (temperature/humidity/bias). It has three conditions to
which the sample can be exposed. (1) 35C/85%RH static for 4 days (2)
50C/85%RH static for 4 days (3) 20 cycles of 25C to 65C/85% RH for 160 hrs.,
all with 100VDC bias.

An 85C/85%RH test would just be a (more severe) variation of this test.

It is available for FREE download at http://www.ipc.org/html/tm2.6.htm.

Tim Reeves



Fellow TechNetters,

   What IPC document covers Reliability Testing such as 85/85.   What is
accomplish by this test.
   What IPC document covers Reliability Testing such as 85/85 with BIAS.
What is accomplish by this test.

Victor G. Hernandez

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