Hi Ioan,
I have never seen--or even heard--about a failure due to voids [you may
want to keep a lookout for my upcoming reliability column in Global SMT
& Packaging magazine on voids in solder joints].
There has been a recent article in Assembly magazine by Donald Cullen
 from MacDermid talking about a SJ failure due to Kirkendall/Champagne
microvoids in power cycling. Unfortunately, it does not give enough
detail or a picture--so far  request for more complete details have
been unsuccessful.
Werner Engelmaier

-----Original Message-----
From: Tempea, Ioan <[log in to unmask]>
To: [log in to unmask]
Sent:         Mon, 17 Oct 2005 09:02:59 -0400
Subject: [TN] Voids in BGAs, again

   Hi Technos,

I know this has been debated at least once a month, but I will not ask
what is
the acceptability.

What I want to know is if anybody had the ocasion to actually see
failures
related to voiding. How did you realize they were due to voiding? Also,
do you
have any dirty pictures of the issue?

Thanks,
Ioan

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