Fellow technetters,

I taught of using Technet's pool of knowledge to get some recommendations on
LCC type devices. We have a customer asking questions on this package, and
all I know is that there are concerns of solder joint cracking due to
board/ceramic CTE mismatch.

What are the pros and cons of LCC devices?
Process and manufacturing recommendations?
Solder joint reliability?
Reliability under extreme environment conditions?

Any comment would be greatly appreciated.

Thanks!

Jorge A Rodriguez
Sr. Process Engineer
Varian, Inc
480-968-6790 X 4258
[log in to unmask]


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