Hi Gregory,

I have been told by our manufacturing department that if the pad is too large it can cause the chip to tombstone.  I have also been told that if the chip component is perpendicular to the travel of the re-flow oven, (i.e. [chip] ------travel----->[chip]  )  then one pad of the chip heats-up before the other pad and will tend to pull the chip or tombstone it.  I was told that the chip needs to be parallel  (i.e.  [chip]   [chip]    ^           ) with the travel of the re-flow.
                                              | travel
                                              |
 



 -----Original Message-----
From: [log in to unmask] [SMTP:MIME :[log in to unmask]]
Sent: Tuesday, January 26, 1999 7:11 PM
To: [log in to unmask]
Subject: [TN] assy:AVX low inductance multilayer capacitors

 << File: ENVELOPE.TXT >>
 --------------------------------------------------------------------------  --
Hi All,


Does anyone have any experience with these parts?  We are currently using
two package styles of this particular part - the 0508 and the 0612 with
some
difficulty.  As you may have guessed the metalization is along the long
edges of the component and our subcontractor is having quite an issue with
tombstoning.  If people are using these components, what are the pad sizes
you are using? We having been using those pad sizes recommended by the
manufacturer.  Also, have you had any test failures due to internal
shorting
of components?  Component specs are as follows:


W=.080 +/- .010
L=.050 +/- .010
t= .005-.020 (terminal width)
T= .030 max thickness
_________________________________________
Gregory Parke
Manufacturing Engineer
NetCore Systems, Inc.
187 Ballardvale Street
Wilmington, MA 01887
(978) 694-1555 x 341            voice
(978) 657-6555                  fax
(888) 430-2925                  pager
[log in to unmask]           e-mail
_________________________________________


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