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October 2012

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Wed, 3 Oct 2012 10:21:25 -0400
Content-Type:
text/plain
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text/plain (58 lines)
Hi Victor,

In 600 rev. H page 109 they show inner layer separation if that helps
you.

It says that on class 2 and 3 none is acceptable. On class 1 boards you
can accept up to 20% separation.

I personally think that the standard should be none allowed.

Sincerely,  

 

Paul Reid 

Program Coordinator  

PWB Interconnect Solutions Inc. 
235 Stafford Rd., West, Unit 103 
Nepean, Ontario Canada, K2H 9C1 

613 596 4244 ext. 229  

Skype paul_reid_pwb 
[log in to unmask] 

 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: October 3, 2012 9:00 AM
To: [log in to unmask]
Subject: [TN] IPC-A-600F, PTH internal capture pad pull away

Fellow TechNetters:

   Once upon a time, in an earlier Rev of the above stated IPC standard,
there was material covering the above topic.   I currently do not see
that topic with the stated document Rev.   Is this still a concern for
PWB raw card qualification.   Land pull away mat be associated with
internal layers/core misregistration.

Victor,

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