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June 1999

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Subject:
Through holes metalization for ceramic
From:
Cheah Li Kang <[log in to unmask]>
Reply To:
"TechNet E-Mail Forum." <[log in to unmask]>, Cheah Li Kang" <[log in to unmask]>
Date:
Mon, 7 Jun 1999 10:51:55 +0800
Content-Type:
text/plain
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text/plain (32 lines) 
Hi

Can anyone provide me some infomation regarding through hole metalization
for ceramic materials? Is that similar to the electroless Cu or direct
metalization process for PWB material such as FR4?

Thanks
Li Kang

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