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Date: | Wed, 2 Feb 2005 12:53:21 -0800 |
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Fellow Manufacturing Techs,
Would some one be so kind as to point me towards any information on IPC
guidelines, Industry standards (if such a thing exist) or "best industry
practice" on the number of times a smt or BGA type of solder connection can
be safely reworked without measurably degrading the solder connection /
solder land attachment on the PCB. For example, how many times can a 0402
smt component, a QFP be changed, or a BGA be changed? The removed component
will be scrapped so I am not worried about is condition after removal.
I suspect that there has been a lot of discussion on this subject over the
years and it ultimately depends on the board's end use, etc.. The use of
trained and skilled solder operators is a must of course. Most of our
boards are considered hi-rel and built to class 3 requirements. Ideally,
know one wants to perform any rework but components do fail and need to be
changed. thanks again
joe
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