Hi Ioan,
Its depend on the component weight, number and diameter of balls, Alloy of
ball / paste.
You will need a sample for a good design.
2/3 of the original height is a good estimation.
Reuven

On Mon, Oct 29, 2012 at 4:31 PM, Ioan Tempea <[log in to unmask]> wrote:

> Dear Technos,
>
> For heatsink attachment purposes, is there any way of knowing what the
> collapsed height of BGA balls will be after soldering? Best would be to
> measure, but I don't have the products and, anyways, the population of
> boards was rather scarce.
>
> Thanks,
>
> Ioan Tempea, ing.
> Ingénieur principal de fabrication / Senior Manufacturing Engineer
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