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March 2015

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From:
"Watson, Howard August" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Watson, Howard August
Date:
Fri, 13 Mar 2015 15:03:27 +0000
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Hi Wayne,

No joke with these parts, it is the real thing. I have all the paper work, and I did purchase the space data package with this lot. It includes all the test data- fine/gross leak, bond pull, RGA, etc. Though some parts were rejected from various screening tests, the lot passed everything. Thanks for your take on this.

Howard A. Watson 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Friday, March 13, 2015 8:50 AM
To: [log in to unmask]
Subject: Re: [TN] Mechanical failure of 8-pin Cerdip

Hi Howard-

Thanks for the amusing photographs!

This is a joke, right? I mean, that picture of the second part looks like it was sitting on the road, and had gotten run over about a dozen times. I don't understand why the leads seem "kind of" straight, but they are enough out of line that I still consider the "road theory" viable.

The first picture reveals that the parts were put together with something crappy. I would like to see shattered glass when the seal breaks! These look like some kind of mal-cured epoxy. Probably there is a hermeticity spec these are supposed to meet and, if you need an excuse to reject them, try doing fine and gross leak tests.

I'm thinking counterfeit, or rather, product that was rejected by the original packaging house which found its way somehow into the brokers market. I know, the manufacturer deflected a decision, but I suspect you are unable to trace the lineage of these parts back to an authorized distributor, right?

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Watson, Howard August
Sent: Friday, March 13, 2015 10:36 AM
To: [log in to unmask]
Subject: [TN] Mechanical failure of 8-pin Cerdip

Hello TechNet,

I have an IC Op Amp that was found in stock with the lid separated. The stock room discovered this while kitting components, so this part was minimally handled. It was stored in the original IC tube. Collectively, we have never seen an occurrence of something like this, and I wonder if any of you have experienced this before. The explanation I got from the manufacturer is that it is most likely a packing and/or handling problem and that if there is too much slack in the tubes, the parts colliding together could cause the lid to pop off. Wouldn't the seal material be more robust than to allow the lid to pop off? My concern is that we have 120 of these all from one lot, and if there was a processing problem, then maybe I have some other poorly bonded lids that may separate. Do you think my concern is valid, or is this a one-off rare handling caused defect? These are space grade parts.

Thanks to Steve, a couple pictures are posted on the links below. I don't know what could be determined from the first picture, other than yes, the lid definitely popped off! The second picture shows another IC with a lid slightly skewed, but within tolerance I believe. Thanks in advance for any suggestions you can offer.

http://stevezeva.homestead.com/RH1078MJ8-1.jpg
http://stevezeva.homestead.com/RH1078MJ8-2.jpg

Howard A. Watson


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