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August 1999

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Subject:
From:
KELLY M SCHRIVER <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 27 Aug 1999 09:07:00 -0400
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Nicholas -

Thermal pads and thermal vias are one of several design techniques to aid in
the conductive cooling of electronic components with large power dissipations.
 The objective being to either redistribute the heat or conduct it to a
thermal plane or thermal rail which can ultimately remove the heat from the
circuit card assembly.

Regards - Kelly

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