TECHNET Archives

April 2018

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 19 Apr 2018 15:31:09 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (6 lines)
Fellow TechNetters:

    Is anyone out there willing to share their experience with Magnaflux Dye Fluorescent Penetrant Testing.   Especially equipment, consumables and results pictures.   Has anyone applied this technique to solder joint and BGA solder bump integrity/fractures.

Victor,

ATOM RSS1 RSS2