TechNet friends -

I am on a short assignment from IPC Government Relations to decide whether
to respond to a US EPA Risk Evaluation on some twenty priority chemicals.
My assignment is NMP and methylene chloride.  Kelly Scanlon of IPC has
already spear-headed evaluations of TBBPA for laminate and for
formaldehyde.

Anyway, we know of NMP use in the multilayer desmear line as a swellant.
We are quantifying the use of NMP to dissolve polyimide (and perhaps other
resins) to be able to coat electronics substrates.

What we don't know is whether NMP (CAS number 872-50-4) is used in other
circuit board applications, or used in mixtures for stripping or cleaning
electronics.   Can you help?

Last, I remember huge amounts of methylene chloride (CAS number 75-09)
being used in the old days of solvent photoresist, but those products are
long gone.   Does your now company use methylene chloride, alone or in
mixtures - again for stripping or cleaning electronics?

If you wish to respond off-line, that is fine with me.

Denny Fritz
Consultant


-- 
Denny Fritz
Consultant
812 584 2687