Subject: | |
From: | |
Reply To: | |
Date: | Fri, 17 Jun 2005 09:23:39 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Technos,
I would need your expert input regarding a global view of electronic assembly reliability.
I want to be able to do the "it depends" part, this means:
* being able to establish the levels I need according to the application
* being able to prescribe the right way of measuring the actual levels (as Vladimir pointed out recently, not any test is relevant for anything)
I also want to be able to do post-mortems and failure analyses.
So, what are the aspects that reliability covers and where can I go for training? A breakdown would be:
* bare PCB reliability (DfM is important, but there must be something else too). Where to go for training?
* component reliability; does it really make sense to embark on this too, I am the assembler. If yes, where to go for training?
* joint reliability; I know where to go for this one, Mr. W.E.
* cleanliness; Brian, Doug, Graham, who is giving seminars on this, it might be my starting point
* coating, potting, underfill; where to go for this one?
Are there any other aspects to cover? I know it is a big task, but will do my best, I promise.
Thanks,
Ioan
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|