Thanks.  I will bring that up with Kelly.   I am not sure she will reach as
far as uses on components.  Guess that does relate to assembly, so maybe
she is interested.

Denny Fritz

On Thu, Dec 5, 2019 at 1:48 PM Bhanu Sood <[log in to unmask]> wrote:

> NMP is used for decapsulation/delayering of certain EEE parts and it is
> called out in standards related to suspect part inspection I have helped
> develop.
>
> On Thursday, December 5, 2019, Dennis Fritz <[log in to unmask]> wrote:
>
> > TechNet friends -
> >
> > I am on a short assignment from IPC Government Relations to decide
> whether
> > to respond to a US EPA Risk Evaluation on some twenty priority chemicals.
> > My assignment is NMP and methylene chloride.  Kelly Scanlon of IPC has
> > already spear-headed evaluations of TBBPA for laminate and for
> > formaldehyde.
> >
> > Anyway, we know of NMP use in the multilayer desmear line as a swellant.
> > We are quantifying the use of NMP to dissolve polyimide (and perhaps
> other
> > resins) to be able to coat electronics substrates.
> >
> > What we don't know is whether NMP (CAS number 872-50-4) is used in other
> > circuit board applications, or used in mixtures for stripping or cleaning
> > electronics.   Can you help?
> >
> > Last, I remember huge amounts of methylene chloride (CAS number 75-09)
> > being used in the old days of solvent photoresist, but those products are
> > long gone.   Does your now company use methylene chloride, alone or in
> > mixtures - again for stripping or cleaning electronics?
> >
> > If you wish to respond off-line, that is fine with me.
> >
> > Denny Fritz
> > Consultant
> >
> >
> > --
> > Denny Fritz
> > Consultant
> > 812 584 2687
> >
>
>
> --
> Bhanu Sood
> Tel: (202) 468-8449
>


-- 
Denny Fritz
Consultant
812 584 2687