Hi Richard,
If you try to solder at or just above the Solidus temperature, you need a 
long time to get wetting [it takes thermal energy to dissolve the base metal into 
Sn], and you may not get good wetting art all. That is why I recommend 
Liquidus+20C for reflow soldering to Cu, and Liquidus+35C for reflow soldering to 
Ni. This time above 183 recommendation of 60 to 90 sec is wrong.



Werner



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