Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 6 Jan 1999 14:59:29 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dear Sirs:
We have an old IPC-AJ-820 Assembly and Joining handbook, dated March/75.
Section 8.0, titled Quality Assurance & Testing, number 8.1.1, Subject:
Round Lead Inspection, contains excellent photos and drawings of solder cup
terminal solder connections. There is also guidance for proper wetting and
solder amounts.
I recently purchased the updated ICP-AJ-820 Assembly and Joining handbook,
dated April 1997. This updated book does NOT include this information.
Has the solder cup terminal information been moved into a different
document? Where I can obtain the latest version of it?
Thank you for your help.
Sincerely,
Karen Kaser
Manufacturing Trainer
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|