Bob,

We both hand-tin and send parts out, and usually go with the hand tinning when it's small batches.
But we try not to tin any leadless components. Some packages probably wouldn't cause much problem, but QFNs can especially be trouble. The difference in size between the center pad and the pins means that you tend to get dissimilar volumes of solder on the tinned part, making them difficult to deal with at assembly. 

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bob Wettermann
Sent: Friday, March 27, 2015 9:29 AM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Retinning to Meet JSTD-001 Guidelines for Gold Plated Parts

We have a contract where we have to place parts per JSTD-001 process guidance (Class 2 and Class 3).

There are some THOLE parts that are gold-plated (RF connectors) wit gold pins and some leadless SMT devices with gold pads.

Based on the client's interpretation of the spec all of these parts need to be tinned.

For such a small lot size (5 boards per P/N) are people hand tinning a few components or send them out to be retinned? What is your experience with the co-planarity of the leadless devices post tinning using a manual process?

Regards


--
Bob Wettermann
BEST Inc


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