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Subject:
Re: BGA rework - adjacent parts reflow
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Thu, 23 Sep 2021 17:07:23 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (14 lines) 
https://www.researchgate.net/publication/ 
252010687_Effects_of_multiple_rework_on_the_reliability_of_lead- 
free_Ball_Grid_Array_assemblies

On Sep 23, 2021, at 11:57 AM, Guy Ramsey wrote:

> We are seeing visual evidence that parts opposite and adjacent to  
> reworked
> BGA are going into reflow. The results are, sometimes,
> intermittent function. Debug identifies problems with the nearby  
> parts.
> Is there a discussion of this in an IPC HDBK or standard?
> White papers? Text?

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