Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 6 Oct 1999 14:28:54 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
On 6 Oct 99 at 7:53, Lustig, Steven K.. wrote:
[......]
>.. as well as a strip where we
> bond a part subsequently.
[...]
.. just curious - do you mean chip bonding (bare dies), any glue
operations with standard components, or wire bonding?
I'm looking for a reliable process to protect wire bonding areas
(mostly immeesion NiAu for Al wire bonding) with something like a
temporary soldermask against any dirt from SMD process, instead of
expensive cleaning processes like plasma...
Thanks, regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://www.mansfeld-elektronik.de
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|