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June 1999

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Subject:
Solder Paste in through hole
From:
"Cathel, Paul" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum." <[log in to unmask]>, "Cathel, Paul" <[log in to unmask]>
Date:
Thu, 3 Jun 1999 08:28:23 -0400
Content-Type:
text/plain
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text/plain (42 lines) 
Hi all,

Does anyone have experience in soldering through hole connectors by applying
solder paste with a stencil and reflowing in a forced convection reflow
oven?


Paul Cathel

Senior Production Eng.

Lockheed Martin

Moorestown, NJ

609-722-3441

[log in to unmask] <mailto:[log in to unmask]>

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