TECHNET Archives

July 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
White Tin Immersion
From:
[log in to unmask]
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 10 Jul 1998 08:55:18 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines) 
To those PCB users of white tin immersion.  Can you give me
   some pros and cons of using this process.     How does it work
   with BGAs  and the typical smt components.    Our suppliers are
  pushing us to this process getting away from hot air leveling.

  Thanks

  Don Fumia

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2