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April 2002

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Subject:
From:
Gary Camac <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 8 Apr 2002 05:32:36 -0500
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Steve,

I would bet you can't feed these on a destacker.  What's is the category of
flux being used?  It is applied on the entire board surface or just at the
soldering locations?

Gary

Gary
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, April 05, 2002 6:33 PM
Subject: [TN] Any SIPAD users?


> Hi All!
>
> I got a few sample boards that a solid solder deposit was applied (SIPAD),
> along with what they call adhesive flux, to play around with. I got some
> dummy components and placed and reflowed them...I was very pleased with
the
> results!
>
> Do any of you use this technology? Any thoughts or opinions would be
> appreciated.
>
> Thanks!!
>
> -Steve Gregory-
>
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