I've read all the excellent comments on this thread and although not all are in agreement I think good points are being made. 

If you wan tto do it right, use the FMEA tools to determine the testing needs. Your FMEA score will let you know what your likelihood of shipping bad product is, and will help you look at ways to minimize it. 

The FMEA process runs somthing like this:

Identify all possible failures modes, their effects and the severity of the effect, and the likelihood that it will occur. 

-> This gets to be a really big task, especially on assemblies with many components, as there are mulitple failures modes for each component, e..g missing, wrong component type, wrong value, out of tolerance, etc. 

Sort the list with those with largest severity, highest likelihood on top, then identify methods to mitigate the failure mode, e.g. test and repair, process change, visual inspection, AOI, etc. 

Continue until your overall FMEA score is low enough such that the risk of shipping bad product is minimal. 

ICT will not detect every failure as was already mentioned. A combination of ICT, AOI, functional testing, etc. will be needed to reduce the risk of shipping defective product to an acceptable level.

Blair

On Thu, 9 May 2013 19:25:28 +0000, Furrow, Robert <[log in to unmask]> wrote:

>Hi all,
>
>I know the goal is "as much as possible", but what is a reasonable expectation for % coverage during ICT for Class 2 products?
>
>Thanks,
>Bob Furrow
>Quality Assurance Engineer
>Honeywell Aerospace - Sarasota
>941-360-6285
>[log in to unmask]
>
>
>______________________________________________________________________
>This email has been scanned by the Symantec Email Security.cloud service.
>For more information please contact helpdesk at x2960 or [log in to unmask] 
>______________________________________________________________________