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Subject:	Re: Lasky looks at RoHS 3 years later
From:	Bob Landman <[log in to unmask]>
Reply To:	Bob Landman <[log in to unmask]>
Date:	Tue, 8 Sep 2009 17:45:10 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (28 lines)

You are correct as the following study shows clearly problems with the laminates, even those supposedly designed for the higher temperature.

http://www.hlinstruments.com//RoHS_articles/APEX%2009%20Bare%20Board%20Material%20Performance%20after%20Pb-free%20Reflow%20-presentation.pdf

Regards,

Bob Landman
H&L Instruments,LLC 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Pete Houwen
Sent: Tuesday, September 08, 2009 9:21 AM
To: [log in to unmask]
Subject: Re: [LF] Lasky looks at RoHS 3 years later

That also ignores the failures due to the much more difficult process.  We don't have the highest quality manufacturing facility, but I suspect many are far less capable.  We have seen significant decreases in yields as a direct result of the lead free process, not neccesarily the solder.  Heat a board to 260C, and you don't need whiskers to make it fail.

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