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September 2003

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Subject:
From:
Kay Nimmo <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 26 Sep 2003 09:23:49 +0100
Content-Type:
text/plain
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text/plain (101 lines)
Hi Dave

I think there must be several different approaches. Firstly for the manufacturers of equipment and secondly for the 'enforcers' who will be implementing the regulations. 

As the TI, National, and other links suggest, suppliers will be required to provide detailed information on the materials used in production of components and other parts to the final equipment producer. Some assembly companies have already set up audit procedures, visiting their suppliers manufacturing plants in order to ensure hazardous materials are not being used, and to specify methods of analysis and certification.Various industry materials information databases are being set up to assist with this type of requirement. This is relatively easy to achieve.

The more difficult question surrounds enforcement of the regulation by the bodies responsible within each EU state; for instance the customs or environmental agencies. This is complicated by the fact that each state is free to choose how to implement the requirements as long as the final aim is achieved. It is also complicated by the fact that the EU decision on the defintion of a Pb-free, and other listed materials-free, will not be published until perhaps december. For instance, the limit for Pb may be defined as 0.1wt% per specific material, or it may be defined as 0.1wt% per materials that can be mechanically seperated, or maybe something else. Of course, it is not possible to define a test method until the requirement is clear (or vice versa). 

It may be that one method will be used to give a general indication of the location of any Pb or other banned substances, and that could then be followed by another method of analysis to give a more precise figure in the area of concern. It is possible for the EU to request a standardisation body to draw up a standard on the method if they think it is required.


You also mentioned this in a previous message (I have been away);
"According to the Japaneese document a Phase 0 is allowed on the equipment
implementation portion of the highway to work out this Leaded and LeadFree
transitioning phase (Roadmap 2002) via JEITA, Soldertec, others
cooperation. What this means for the content of Lead allowed in LF during
this short phase is unknown to me right now. By the way I think some have
already exited this Equipment Phase 0."

I am not sure about phase 0 - I think that would be what is now called phase 1. Basically it covers the use of components in a Pb-free assembly process. So the components can still contain any amount of Pb but must be rated at a suitable temperature for Pb-free processing with e.g. SnAgCu solders. You are right in thinking that this is just an intial stage that many sites have moved on from. It does not indicate a Pb-free or RoHS compliant product.

The details of the various phases are in the roadmap document page 17-18 ;
http://download.lead-free.org/downloads/EU_roadmap_2003_ver2_lab.pdf

regards
Kay

-----Original Message-----
From: MA/NY DDave [mailto:[log in to unmask]]
Sent: 25 September 2003 14:13
To: [log in to unmask]
Subject: Re: [LF] Standard Test Method For Determining % Pb in PCAs


Hi Jos, and IPC LF Listservers,

Yes I figured that out already, by looking at the complexity in
both documents.

In thinking about how to create a physical test, pulverizing followed
by this ICP test, that could get at percent by weight for an average
solder joint or for all the PCB / PW Assembly surface lead (Pb) which
included all the joints I mentally ran into a nightmare. What did I
include as the base weight. Pre pulverizing could I cut furthur on up
leads or bring in other material below to make my Pb percent by weight
lower. What did I do with Flip Chips tight to the surface. Or would I
construct a dummy vehicle that everyone would utilize in their reporting.

At a full packaged component level I understand the value of ICP yet
the insides of components are allowed the higher Pb content to create
a Soldering Heirarchy so I had to exclude that Lead content.

I will be anxious to see if any readers have a one click link to a
test method that the EU and most of it's countries might approve.

My guess is that even trace amounts of Pb in the wrong places will
be enough to trigger a rejection.

Anyway here beyond what Doug has gave us was one National Link
that said the same thing TI-Doug basically wrote above.

<http://www.national.com/packaging/leadfree/european_dir_comp.html>


YiEngr, MA/NY DDave

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