You can't have it both ways.
Werner
-----Original Message-----
From: Reuven Rokah <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sun, 16 Nov 2008 7:35 am
Subject: RE: [LF] Accelerated reliability model for SAC405/305 solder joint creep-fatigue
Yes but it not RoHS comply…
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Best Regards
Reuven ROKAH
Chief of Technologies
Network Solutions Division / Engineering
ECI Telecom LTD.
30 Hasivim St. Petah-Tikva 49517
ISRAEL
Tel: 972-3-9266734 Mobile:972-524006734
Fax: 972-3-9263542
e mail: [log in to unmask]
P Think
green before printing this mail... Thanks
From: [log in to unmask]
[mailto:[log in to unmask]]
Sent: Sunday, November 16, 2008 2:32 PM
To: Reuven Rokah
Subject: Re: [LF] Accelerated reliability model for SAC405/305 solder
joint creep-fatigue
Hi Reuven,
Sure there is a proven way to
prevent whiskers
,—put lead in the solder.
Werner
-----Original Message-----
From: Reuven Rokah <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Sun, 16 Nov 2008 1:34 am
Subject: RE: [LF] Accelerated reliability model for SAC405/305 solder joint
creep-fatigue
Hi Werner,
Cracks = broken solder joints / opens may appear after thermal
and or mechanical stress .
Do you think that after your accelerated reliability model, the EU
will expedite their decision to annul the lead in solder exemption?
Regarding whiskers, any recipe how to minimize it to zero? Or a
model to predict t he appearance of whiskers.
-------------------------------------------------------------------------------------------------------------------------
This transmission and any files attached to it contains confidential
and/or proprietary information and is intended only for the named recipient.
If you are not the intended recipient, you are hereby notified that any
re-transmission, dissemination, disclosure or copying of this information is
strictly prohibited.
--------------------------------------------------------------------------------------------------------------------------
Best Regards
Reuven ROKAH
Chief of Technologies
Network Solutions Division / Engineering
ECI Telecom LTD.
30 Hasivim St. Petah-Tikva 49517
ISRAEL
Tel: 972-3-9266734 Mobile:972-
524006734
Fax: 972-3-9263542
e mail: [log in to unmask]
P Think
green before printing this mail... Thanks
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Saturday, November 15, 2008 12:05 AM
To: Reuven Rokah; [log in to unmask]
Cc: [log in to unmask]
Subject: Re: [LF] Accelerated reliability model for SAC405/305 solder
joint creep-fatigue
Hi Reuven,
Look for my reliability column in the december issue of Global SMT &
Packaging magazine.
What are "Crakes"? Whiskers fall under the category of
'Non-Repeatable Experiments'—how could you possibly model them?
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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