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April 2008

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Subject:
From:
"James, Chris" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 30 Apr 2008 16:14:07 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (218 lines)
Richard - You might like to submit the/a picture(s) to the NPL defect

data base http://defectsdatabase.npl.co.uk/ as they currently only have

one picture it would appear.





-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.

Sent: 30 April 2008 14:51

To: [log in to unmask]

Subject: Re: [LF] tin whiskers / reports of nasa



Steve, I am sending you a couple of pictures via a separate email of

recent (last week) tin whiskers seen on a RoHS I.C. on lead-free

product, if you could be so kind as to post them on your website. This

is just one example, I have lots more. The point I am trying to make is

that the whisker issues are becoming widespread, and will eventually

carry over into more COTS parts used in high-rel applications.  



-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of Steve Gregory

Sent: Wednesday, April 30, 2008 8:34 AM

To: [log in to unmask]

Subject: Re: [LF] tin whiskers / reports of nasa



Hi Wolf!



I don't have any direct experience with tin whisker failures, but as a

production engineer for an EMS company, I wouldn't really know of any

failure unless one of our customers told us about it. We just build

things and ship them. We don't follow the product through their lives

like our customers do. 



We also don't build that much lead-free here, but we have the capability

(dual wave solder pots etc.), and it's just because of our customer

base. Most of our customers are either high-rel or military, and forbid

tin plated components.



Another link that talks about more than just relay whiskers is from

CALCE:



http://www.calce.umd.edu/lead-free/tin-whiskers/TINWHISKERFAILURES.pdf



Steve



-----Original Message-----

From: Leadfree [mailto:[log in to unmask]] On Behalf Of SCHMIDT,

WOLF-DIETER - PFHO

Sent: Wednesday, April 30, 2008 1:27 AM

To: [log in to unmask]

Subject: [LF] tin whiskers / reports of nasa



Hello Steve,



in between I've read most of the available reports related to the your

link.

Nearly all reports point out that the tin cover on mechanical parts have

been the base for tin whisker growth:



       << DirecTV 3 ......  Boeing 601-model satellite ...... 

          being caused by the growth of metal filaments in a relay .....

<<



       >> Galaxy VII Lost ..... failures in Boeing 601

satellites........

          tin whiskers grow in the vacuum of space on internal

          tin-plated relay latching switches..... <<



(a lot of reports on the 601 - bad luck for Boeing products)



       >> report by Gordon Davy1, Northrop Grumman Electronic Systems,

          Baltimore, MD: "Relay Failure Caused by Tin Whiskers" << 



... and a lot more reports decribing the same.



Interesting are the two Westinghouse reports:

       # diode lead as base of a whisker

       # mechanical part of a potentiometer



The link



        >> Patriot Missile:  Anoplate WWW Site:

           Suspected tin whisker related problems (Fall 2000) <<



gives explanations under which conditions tin whiskers will grow and

this is due to my knowledge as well. Tin covered mechanical parts will

be able to produce tin whiskers if mechanical stress ist introduced to

them. In all those cases the tin cover was made by galvanic processes

but not by melting tin on a copper or brass metal sheet. It is also well

known, that the risk of tin whiskers out of tin on copper (or alloys

containing a high percentage of copper) is much higher than whiskers out

of tin on a nickel barrier.



It is reported that even out of Sn60Pb40 you may have some tin whiskers

if the conditions are given. 



The only report which not basicly refferes to a mechanical part is one

of the two mentioned Westinghouse reports. There the anode lead of a

diode was diagnosed to be the root of failure. In this very case it

would be interesting to know whether the whiskers have been grown out of

the lead at it's bend or not.



So in my oppinion the risk of tin whiskers on an printed board assembly

with electronic components (not regarding electromechanical parts !) is

quite low, especially when produced using reflow soldering. Then most of

the stress on components leads and the tin coverage - if there has been

some stress - will be removed. And the copper lines on the board

themselves normally cannot be mechanically stressed. An additional

method to be more aware of tin whiskers is to use gold over Nickel as

metal plating on the board - we have experience with this for about 15

years and thousands of boards with very good results.



I would like to know what's your thinking on the points mentioned

before.



Regards



Wolf-Dieter Schmidt

Industrial Engineering

-----------------------------------------------------------

THALES Defence Deutschland GmbH

Land & Joint Systems

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D-75175 Pforzheim - Germany

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Phone: +49 7231 15 3386

Fax: +49 7231 15 3390

mailto: [log in to unmask]

http://www.thalesgroup.com



Registered Seat: Berlin

Commercial Register Charlottenburg HRB 93875 B Managing Directors: Dr.

Markus Hellenthal (Chairman), Peter Obermark, Dr.Henning Biebinger

Chairman of the Supervisory Board: Alex Dorrian



This e-mail is confidential and intended solely for the use of the

individual to whom it is addressed. Any views or opinions presented are

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If you have received this e-mail in error please notify Thales.











> -----Original Message-----

> From: Steve Gregory [mailto:[log in to unmask]]

> Sent: Monday, April 21, 2008 5:22 PM

> To: (Leadfree Electronics Assembly Forum); SCHMIDT, WOLF-DIETER - PFHO

> Subject: RE: [LF] The Cost of EU RoHS: $32.7B

> 

> 

> Hi Wolf!

> 

> Here's a link you might want to look at:

> 

> http://nepp.nasa.gov/whisker/failures/index.htm

> 

> Steve



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