Bob,
Is there a recommended LF FLUX Remover for BGA. A glass like
residue surround the BGA periphery on the PCB side which form a tight
seals which hinders the use of a DYE PENETRANT Process for BGA Integrity
Test. Any comments on this issue.
Victor.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Bob willis
Sent: Thursday, June 24, 2004 1:02 AM
To: [log in to unmask]
Subject: Re: [LF] LF BGAS on Tin/Lead PCBs process
I am contributing a small section of work on this subject for the NPL
Team, the complete project plan can be seen at www.npl.co.uk/ei
Bob Willis
2 Fourth Ave, Chelmsford,
Essex, CM1 4HA, England
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Reuven ROKAH
Sent: 20 June 2004 06:40
To: [log in to unmask]
Subject: Re: [LF] LF BGAS on Tin/Lead PCBs process
Thanks Roger, and Bob
This issue of soldering Lead Free BGAs on Tin lead PCBs and process is
an actual issue that is relevant now and will be more relevant as we are
moving to the July 2006 . More and more suppliers are moving to Lead
Free BGAs and closing the Tin Lead BGAs production.
I hope that some new Formal research's will be available regarding
reliability issues of such solder joints and even IPC or Soldertec may
clarify this issue.
Such as :Comparison table with strong and weak points of LF vs Tin
Lead:
1. Structure of the solder joint (metallurgical aspect).
2. Strength , elasticities of the solder joins.
3. Resistance to vibration, cold, heat,
4. Coplanarity
5. Conductivity
Etc.
Best Regards
Reuven ROKAH
Roger Bilham
<[log in to unmask] To: "(Leadfree
Electronics Assembly Forum)" <[log in to unmask]>,
n.co.uk> [log in to unmask]
cc:
18/06/2004 09:48 Subject: Re: [LF] LF BGAS
on Tin/Lead PCBs process
Please respond
to Roger Bilham
Reuven,
There are many references to this situation - some claiming less
reliability than completely lead-free and some more. One, claiming less
reliability, which I came across yesterday is: Nurmi et al., "The
influence of multiple reflow cycles on solder joint voids for lead-free
BGAs", Soldering and Surface Mount Technology, (15) no. 1, 2003, p31-38.
Regards,
Roger Bilham
[log in to unmask]
http://www.bilham.demon.co.uk
In message <[log in to unmask]>, Reuven
ROKAH <[log in to unmask]> writes
>Hi All,
>
>Any progress with the ability to solder Lead Free BGAs components on
>Tin/Lead PCBs process ???
>
>Any reliability reports, cross sections, pull tests etc.???
>
>Best Regards
>
>Reuven ROKAH
>
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--
Roger Bilham
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