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February 2005

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Subject:
Flip Chip Bump Solder Question
From:
Greg Kowal <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 9 Feb 2005 20:13:20 -0500
Content-Type:
text/plain
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text/plain (29 lines) 
I have read proposed changes/addition to the annex of exemptions will
include “Lead in solders to complete a viable electrical connection
between semiconductor die and carrier within integrated circuit Flip
Chip packages”.

How is this interpreted, is it all solder used for Flip Chip bumps
(including eutectic) and not just high lead bumps?

Thank you,

Greg Kowal

=====
Greg Kowal
Vancouver, BC



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