Eric -
Generally speaking, no equipment changes should be needed. Now, let me
qualify that statement. The reflow profile, in lead-free will have a higher
temperature requirement with basically the same slopes. Therefore, using the
same equipment, the belt speed will have to be slowed down thus affecting
the throughput of the oven for the same assemblies. If there is excess
capacity in the reflow oven portion of the process, then there will be no
problem. If there is no excess capacity, then a longer oven will be required
for the same or greater throughput.
All reflow ovens should be capable of the higher reflow temperatures with no
adverse equipment effects.
If you are using Automated Optical Inspection (AOI) for post-reflow solder
joint inspection, you will probably have to revise your equipment's
inspection criteria, and may have to change you AOI equipment. All of that
depends on your current equipment's capabilities.
The stencil printing process parameters for your equipment will most likely
change but the new parameters should be no problem for virtually all
printing equipment. There should be no foreseeable effect on the Placement
systems.
In summary, in most cases there should be no equipment changes. The major
changes are the materials and the process parameters for solder paste
printing, reflow, and inspection criteria.
Good Luck!
Ed Valentine
Edward J. Valentine
Electronics Manufacturing Solutions
5702 Myakka Court
Raleigh, NC USA 27616-3243
Phone: (919) 270-5145
[log in to unmask]
www.ems-consulting.com
----- Original Message -----
From: "Eric Williams" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, March 09, 2003 9:57 PM
Subject: [LF] Equipment changes needed for lead-free
Hello,
I am trying to find out more about what equipment changes are needed to
switch board manufacturing and assembly facilities to lead-free. I am trying
to get an idea of how difficult making the change would be for small and
medium size firms in terms of investment in new equipment. The answer no
doubt depends on what alternative is being used but I would very much
appreciate hearing from people in the group about what they have heard/read
about the different options.
1. For PWB manufacturing, making boards that stand up to higher temperatures
apparently requires some change in materials, no? Does any equipment need to
be replaced to make these modified boards?
2. For PWB assembly, one could break down the process flow into printing,
placement, reflow/wave, inspection. On the lead-free website, Brian Bauer
and Angela Grusd hint that for Su/Ag/Cu solder, inspection may be most
affected (needing new equipment?). Harvey Miller, a member of the list,
makes an estimate of capital costs assuming that only reflow/wave ovens will
need to be replaced. A source in the Taiwanese electronics industry suggests
that the lead-free switch is really only about materials and that no
equipment needs to be changed. As far as I have found so far, no one is
suggesting that the printing and placement machines need changing. According
to your experiences/knowledge, what equipment needs to be replaced? Are
there written analyses of this issue?
Thanks very much.
Best Regards, Eric
---------------------------------------------------------------------
Eric Williams
United Nations University
Environment and Sustainable Development Programme
IT and Environment Project
http://www.it-environment.org
53-70 Jingumae 5-chome Shibuya-ku Tokyo, Japan
Phone: 81-3-5467-1352 Fax: 81-3-3406-7346
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