I thought the problem with tin and silver was the formation of brittle
Sn-Ag intermetallics when the silver content exceeded 10 % by weight.

Kirk Mueller





Doug Romm <[log in to unmask]> on 09/22/99 08:48:13 AM

Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Kirk D Mueller/RWS/Raytheon/US)
Subject:  [LF] Pb-free Alternatives using Ag




All,

Several of the Pb-free options being offered for use in both solders and
component lead plating include silver (Ag), for example Sn/Ag.  In the past
some users of IC components have had concerns/problems with use of Ag in
components because of silver dendrite growth.  Is there any concern about
use of Ag in these Pb-free alternatives?  If not please provide a brief
technical explanation of why not.

This question may have been raised previously, but I can't find the answer.



Best regards, Doug Romm

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