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April 2003

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Subject:
Mix Finishes on components on PCB
From:
Reuven ROKAH <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sun, 27 Apr 2003 13:22:16 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines) 
Hello Furum members,

Lately I am receiving from suppliers that they are changing theirs
components finishes to lead free (100% Tin plated) or other lead free
finsh.

Pls recommend:

-     Staying with the 220 deg C peak in reflow process.
-     Changing to 240 - 250 deg. C.

Pls indicate your Advantagaouse and dis advantagaouse.

Best  Regards

ROKAH Reuven

Fax: 972-3-9266480
e mail: [log in to unmask]

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