Luc, Bob,
You have both added interesting things to the mix.
1) Most people who even have XRF systems (even new ones) are going to have instruments that are good for 2% and if they are lucky 1%. They are not going to be able to detect 0.1%. It seems that most solder manufacturers favor 0.2%, as there is some sort of quantum difference in separation costs going lower. This has not been explained to me in detail.
2) Bob, have you tried the little test kit you can get at any paint store to determine if you have lead containing paint on your walls? If so, how sensitive is it?
regards,
Bev Christian
Research in Motion
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: September 26, 2003 6:25 AM
To: [log in to unmask]
Subject: Re: [LF] Standard Test Method For Determining % Pb in PCAs
Hello,
There are up-to date X-ray fluorescence system (using thin tube
collimators) which allow to detected polluted coatings have Pb inside.
Surely this method is checking only a spot on the coating (50µm to
300µm).
We have been able to control Tin coated with Pb pollution as well as
polluted solder bumps.
If you come to the problem of the 1000ppm above or below , let me
explain that this level was proposed mainly to avoid tigh controls .
Proper process maintenance should allow easily to pass that criteria
considering the Tin anods will be much less than 500ppm Lead.
best regards
L.P.
______________________________ Reply Separator _________________________________
Subject: Re: [LF] Standard Test Method For Determining % Pb in PCAs
Author: bob ([log in to unmask]) at internet
Date: 09/26/03 10:33 AM
I very interesting discuss so far but at a practical level engineers and
quality staff will just want to have a simple test kit to tell if it has
lead in the component plating, on the PCB or in the joint. If there is they
can then move on to a laboratory test to determine the exact %.
I am currently doing a couple of tests on kits and would be most interested
to hear about this level of testing from other people who are already
looking at this level of assessment.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Kay Nimmo
Sent: 26 September 2003 09:24
To: [log in to unmask]
Subject: Re: [LF] Standard Test Method For Determining % Pb in PCAs
Hi Dave
I think there must be several different approaches. Firstly for the
manufacturers of equipment and secondly for the 'enforcers' who will be
implementing the regulations.
As the TI, National, and other links suggest, suppliers will be required to
provide detailed information on the materials used in production of
components and other parts to the final equipment producer. Some assembly
companies have already set up audit procedures, visiting their suppliers
manufacturing plants in order to ensure hazardous materials are not being
used, and to specify methods of analysis and certification.Various industry
materials information databases are being set up to assist with this type of
requirement. This is relatively easy to achieve.
The more difficult question surrounds enforcement of the regulation by the
bodies responsible within each EU state; for instance the customs or
environmental agencies. This is complicated by the fact that each state is
free to choose how to implement the requirements as long as the final aim is
achieved. It is also complicated by the fact that the EU decision on the
defintion of a Pb-free, and other listed materials-free, will not be
published until perhaps december. For instance, the limit for Pb may be
defined as 0.1wt% per specific material, or it may be defined as 0.1wt% per
materials that can be mechanically seperated, or maybe something else. Of
course, it is not possible to define a test method until the requirement is
clear (or vice versa).
It may be that one method will be used to give a general indication of the
location of any Pb or other banned substances, and that could then be
followed by another method of analysis to give a more precise figure in the
area of concern. It is possible for the EU to request a standardisation body
to draw up a standard on the method if they think it is required.
You also mentioned this in a previous message (I have been away);
"According to the Japaneese document a Phase 0 is allowed on the equipment
implementation portion of the highway to work out this Leaded and LeadFree
transitioning phase (Roadmap 2002) via JEITA, Soldertec, others
cooperation. What this means for the content of Lead allowed in LF during
this short phase is unknown to me right now. By the way I think some have
already exited this Equipment Phase 0."
I am not sure about phase 0 - I think that would be what is now called phase
1. Basically it covers the use of components in a Pb-free assembly process.
So the components can still contain any amount of Pb but must be rated at a
suitable temperature for Pb-free processing with e.g. SnAgCu solders. You
are right in thinking that this is just an intial stage that many sites have
moved on from. It does not indicate a Pb-free or RoHS compliant product.
The details of the various phases are in the roadmap document page 17-18 ;
http://download.lead-free.org/downloads/EU_roadmap_2003_ver2_lab.pdf
regards
Kay
-----Original Message-----
From: MA/NY DDave [mailto:[log in to unmask]]
Sent: 25 September 2003 14:13
To: [log in to unmask]
Subject: Re: [LF] Standard Test Method For Determining % Pb in PCAs
Hi Jos, and IPC LF Listservers,
Yes I figured that out already, by looking at the complexity in
both documents.
In thinking about how to create a physical test, pulverizing followed
by this ICP test, that could get at percent by weight for an average
solder joint or for all the PCB / PW Assembly surface lead (Pb) which
included all the joints I mentally ran into a nightmare. What did I
include as the base weight. Pre pulverizing could I cut furthur on up
leads or bring in other material below to make my Pb percent by weight
lower. What did I do with Flip Chips tight to the surface. Or would I
construct a dummy vehicle that everyone would utilize in their reporting.
At a full packaged component level I understand the value of ICP yet
the insides of components are allowed the higher Pb content to create
a Soldering Heirarchy so I had to exclude that Lead content.
I will be anxious to see if any readers have a one click link to a
test method that the EU and most of it's countries might approve.
My guess is that even trace amounts of Pb in the wrong places will
be enough to trigger a rejection.
Anyway here beyond what Doug has gave us was one National Link
that said the same thing TI-Doug basically wrote above.
<http://www.national.com/packaging/leadfree/european_dir_comp.html>
YiEngr, MA/NY DDave
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